| 1. | Materials for interconnection structures - sectional specification set for non - conductive films and coatings - marking legend inks
互连接结构用材料.不导电薄膜和涂层分规范.打印油墨 |
| 2. | Materials for interconnection structures - sectional specification set for restraining core materials - copper invar copper
互连接装置用材料.第7部分:芯约束用材料分规范.第1节:铜殷钢铜 |
| 3. | Materials for interconnection structures - sectional specification set for non - conductive films and coatings - temporary polymer coatings
连接结构用材料.非导电膜和涂层分规范.临时聚合物规范 |
| 4. | Test methods for electrical materials , interconnection structures and assemblies . part 1 : general test methods and methodology
电工材料互连构件和组件的试验方法.第1部分:一般试验方法和方法论 |
| 5. | Test methods for electrical materials , interconnection structures and assemblies - part 1 : general test methods and methodology
电气材料互连结构和组装件的试验方法.第1部分:一般试验方法和分类法 |
| 6. | Materials for interconnection structures . part 7 : sectional specification set for restraining core materials . section 1 : copper invar coper
互连结构用材料.第7部分:限制芯材料用分规范集.第1节:铜殷钢铜 |
| 7. | Materials for interconnection structures - part 7 : sectional specification set for restraining core materials - section 1 : copper invar copper
互连接装置用材料.第7部分:芯约束用材料分规范.第1节:铜殷钢铜 |
| 8. | Materials for interconnection structures - sectional specification set for conductive foils and films with and without coatings - conductive inks
内部连接结构材料.有或无涂层的导电箔和导电膜分规范.导电墨水 |
| 9. | Test methods for electrical materials , interconnection structures and assemblies - part 3 : test methods for interconnection structures printed boards
电气材料互连结构和部件的试验方法.第3部分:互连结构的试验方法 |
| 10. | Test methods for electrical materials , interconnection structures and assemblies - part 3 : test methods for interconnection structures printed boards
电气材料互连结构和组件的试验方法.第3部分:互连结构的试验方法 |
